“Solderability and Tinning: Does the Industry Know the Difference?” Published in December’s U.S. Tech

Solderability and Tinning: Does the Industry Know the Difference?” written by NJMET’s Joseph Federico appears in the December, 2015 issue of U.S. Tech.

Solderability Testing

Solderability testing determines if the surface finish of components will provide for acceptable solder connections.  Since the solder finish can degrade over time, solderability testing using accelerated aging techniques can estimate the storage life of components.


Tinning is the method of replacing the existing surface finish of a solderable termination with a new one.  By dipping the components into a molten solder bath, the tin dissolves and removes the existing surface finish.  Upon removal from the bath, the component has a new solder finish.

US_TechClick on this link to read the original anouncement.

U.S. Tech is the major publication for the electronics manufacturing industry.  It has been reporting on new developments in the industry for over 30 years.  This is Mr. Federico’s second article published by U.S. Tech.

You can't leave comments on this post but you can leave a trackback here: